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PolyMide™ is a family of Nylon/polyamide-based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing.
PolyMide™ CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and a heat resistance of up to 180˚C.
The Pi-Plates DAQC2plate (DAC-SEE-Too) builds upon our highly successful DAQCplate by adding greater precision, more power and more features.